Solvay Expands Offering of High-Performance Polymers for 3D-Printing Simulation

    Bollate, ITALY, Jan. 30, 2019 — Solvay adds 10% carbon fiber filled KetaSpire® polyetheretherketone (PEEK) and neat Radel® polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat®-Additive Manufacturing (AM) software. These products complement the neat KetaSpire® PEEK AM filament already available for Read More »

Image courtesy of Solvay