Printed Litz Line: nScrypt Advances Printed Electronics With New Patent

Orlando, FL/July 12, 2022 — nScrypt’s research arm, Sciperio, has received US Patent no. 10,966,312, entitled “Printed Litz Line,” which has two independent claims and twelve dependent claims and covers a method of 3D printing a litz line.

A litz line is essentially a wire made of individually insulated strands twisted or woven together, used in electronics to carry current at radio frequencies (RF).  Litz wire reduces increased resistance that wire experiences at higher frequencies. 

The patent covers a method of printing an equivalent of a litz wire, using 3D printing, laser cutting, milling, etching, or masking.  By printing multiple conductive tracts in a pattern on a substrate, such as a bare die, the resulting printed litz line increases conductance compared to a single conductive line.  The 3D printing process may be material jetting or spray, material extrusion, dispensing (such as with nScrypt’s SmartPump^TM microdispensing tool head), or other processes for applying materials.  The printed litz line may have a thickness of less than 100 um, may be printed conformally on a surface of any virtually any shape, and may extend through vias.

According to Dr. Ken Church, CEO of nScrypt and Sciperio:

“People who know RF applications will know this is a big deal.  It’s one part of fully functional printed electronics.  nScrypt’s 3D manufacturing systems can 3D print complex structures of electronic devices, mill the surface before printing the litz lines, print the litz lines and other conductive lines with great precision at micro-scale, through vias if necessary, pick and place electronic components, and mill or polish the surface of the completed device, all in one system with automatic tool changes and therefore minimal labor.”

nScrypt and Sciperio patents are available for licensing under mutually favorable terms.   On this point, Dr. Church says, “We want to see printed electronics and 3D manufacturing move forward as an industry, with innovation lifting all boats, without patents getting in the way.”