Solvay Expands Offering of High-Performance Polymers for 3D-Printing Simulation

    Bollate, ITALY, Jan. 30, 2019 — Solvay adds 10% carbon fiber filled KetaSpire® polyetheretherketone (PEEK) and neat Radel® polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat®-Additive Manufacturing (AM) software. These products complement the neat KetaSpire® PEEK AM filament already available for Read More »

Image courtesy of Solvay

Solvay Enables Simulation Solutions for High-Performance 3D Printed Parts with Software Support from e-Xstream Engineering

  Alpharetta, Ga., April 25, 2018 — Solvay further established itself as an emerging leader in specialty polymers for additive manufacturing (AM) today with the news that high-performance KetaSpire® PEEK AM filament will be the first polyetheretherketone polymer included in e-Xstream engineering’s Digimat® simulation software Read More »

Image courtesy of Solvay