3D Printing Electronics Packaging For Harsh Environments

Orlando, FL, July 28, 2020:  A joint test conducted by researchers of the U.S. Air Force Research Laboratory, Oak Ridge National Laboratory, Ball Aerospace & Technologies Corporation, Brigham Young University, U.S. Army RDECOM-ARDEC, and nScrypt, Inc.’s research arm, Sciperio, used two types of 3D printing Read More »

Image courtesy of nScrypt

Ozark IC Uses nScrypt 3D Manufacturing System for High-Temperature Printing

Orlando, FL: Ozark Integrated Circuits, Inc. (Ozark IC) is working with nScrypt’s research arm, Sciperio, and an nScrypt 3D manufacturing system to create high temperature electronic systems, specifically, a RISC-V processor that would operate for extended times on the surface of Venus, where the temperature Read More »

Image courtesy of nScrypt

USF and nScrypt Show How 3D Printed Circuit Structures Can Replace PCBs

In an SMTA white paper recently posted by Circuitnet, Orlando, Florida-based nScrypt, its research arm Sciperio, and researchers at the University of South Florida described a roadmap for using 3D printing to move from Printed Circuit Boards (PCBs), which are standard in electronics packaging designs Read More »

Image courtesy of nScrypt